燙(tang)金(jin)基(ji)本工藝是在壓力狀(zhuang)態(tai)，即電(dian)化(hua)(hua)(hua)鋁被燙(tang)印(yin)(yin)版、承印(yin)(yin)物壓住的(de)狀(zhuang)態(tai)下，電(dian)化(hua)(hua)(hua)鋁受(shou)熱使其上熱熔(rong)(rong)(rong)性的(de)有機硅樹脂層和膠(jiao)(jiao)牯(gu)劑(ji)(ji)熔(rong)(rong)(rong)化(hua)(hua)(hua)，此(ci)時(shi)(shi)受(shou)熱熔(rong)(rong)(rong)化(hua)(hua)(hua)的(de)有機硅樹脂粘性變小，而特種熱敏膠(jiao)(jiao)粘劑(ji)(ji)受(shou)熱熔(rong)(rong)(rong)化(hua)(hua)(hua)后粘性增加，使得鋁層與電(dian)化(hua)(hua)(hua)鋁基(ji)膜剝離的(de)同時(shi)(shi)轉(zhuan)印(yin)(yin)到了承印(yin)(yin)物上。隨著壓力的(de)卸除，膠(jiao)(jiao)粘劑(ji)(ji)迅速冷卻固(gu)化(hua)(hua)(hua)，鋁層牢固(gu)地附著在承印(yin)(yin)物上，完(wan)成(cheng)一個燙(tang)印(yin)(yin)過(guo)程(cheng)。