燙(tang)金(jin)基(ji)本(ben)工藝是在壓(ya)力狀態(tai)，即電化(hua)(hua)鋁(lv)被(bei)燙(tang)印(yin)(yin)版、承印(yin)(yin)物(wu)壓(ya)住的狀態(tai)下，電化(hua)(hua)鋁(lv)受(shou)(shou)熱(re)使其上熱(re)熔(rong)性(xing)(xing)的有(you)機(ji)硅(gui)樹(shu)脂層和膠(jiao)牯劑熔(rong)化(hua)(hua)，此時(shi)受(shou)(shou)熱(re)熔(rong)化(hua)(hua)的有(you)機(ji)硅(gui)樹(shu)脂粘(zhan)(zhan)性(xing)(xing)變小，而特(te)種熱(re)敏膠(jiao)粘(zhan)(zhan)劑受(shou)(shou)熱(re)熔(rong)化(hua)(hua)后(hou)粘(zhan)(zhan)性(xing)(xing)增加(jia)，使得鋁(lv)層與(yu)電化(hua)(hua)鋁(lv)基(ji)膜剝離的同時(shi)轉印(yin)(yin)到(dao)了(le)承印(yin)(yin)物(wu)上。隨著壓(ya)力的卸(xie)除，膠(jiao)粘(zhan)(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)層牢固地附著在承印(yin)(yin)物(wu)上，完成(cheng)一(yi)個燙(tang)印(yin)(yin)過程(cheng)。