燙金基(ji)本工(gong)藝是在(zai)壓力(li)狀態，即電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)被(bei)燙印(yin)版、承印(yin)物(wu)壓住(zhu)的狀態下(xia)，電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)受(shou)(shou)熱使其上熱熔(rong)性(xing)的有機硅樹(shu)脂層(ceng)和膠(jiao)牯劑熔(rong)化(hua)(hua)(hua)，此時受(shou)(shou)熱熔(rong)化(hua)(hua)(hua)的有機硅樹(shu)脂粘(zhan)性(xing)變小(xiao)，而特種熱敏膠(jiao)粘(zhan)劑受(shou)(shou)熱熔(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)(lv)層(ceng)與電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)基(ji)膜(mo)剝離的同時轉印(yin)到了承印(yin)物(wu)上。隨著壓力(li)的卸除，膠(jiao)粘(zhan)劑迅速冷卻固化(hua)(hua)(hua)，鋁(lv)(lv)層(ceng)牢(lao)固地附著在(zai)承印(yin)物(wu)上，完成一個燙印(yin)過程(cheng)。