燙(tang)金基本工藝(yi)是在(zai)壓力狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)被(bei)燙(tang)印(yin)版、承印(yin)物(wu)(wu)(wu)壓住的狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)受(shou)(shou)熱使其上熱熔(rong)性(xing)(xing)的有機硅(gui)樹脂(zhi)層和膠牯劑熔(rong)化(hua)(hua)(hua)，此時(shi)受(shou)(shou)熱熔(rong)化(hua)(hua)(hua)的有機硅(gui)樹脂(zhi)粘(zhan)(zhan)性(xing)(xing)變小，而特種熱敏膠粘(zhan)(zhan)劑受(shou)(shou)熱熔(rong)化(hua)(hua)(hua)后粘(zhan)(zhan)性(xing)(xing)增加，使得鋁(lv)層與電(dian)化(hua)(hua)(hua)鋁(lv)基膜剝離的同時(shi)轉印(yin)到(dao)了承印(yin)物(wu)(wu)(wu)上。隨著(zhu)壓力的卸除，膠粘(zhan)(zhan)劑迅速冷卻(que)固化(hua)(hua)(hua)，鋁(lv)層牢固地附著(zhu)在(zai)承印(yin)物(wu)(wu)(wu)上，完(wan)成一個燙(tang)印(yin)過程(cheng)。