燙金基(ji)本(ben)工藝(yi)是在(zai)壓(ya)力狀(zhuang)態(tai)，即電(dian)化(hua)鋁(lv)(lv)被燙印版、承(cheng)印物壓(ya)住的(de)狀(zhuang)態(tai)下，電(dian)化(hua)鋁(lv)(lv)受(shou)熱使(shi)其上(shang)(shang)熱熔(rong)性(xing)的(de)有機硅樹(shu)脂層(ceng)和膠牯(gu)劑熔(rong)化(hua)，此時(shi)受(shou)熱熔(rong)化(hua)的(de)有機硅樹(shu)脂粘(zhan)性(xing)變小，而特種熱敏膠粘(zhan)劑受(shou)熱熔(rong)化(hua)后粘(zhan)性(xing)增(zeng)加，使(shi)得鋁(lv)(lv)層(ceng)與(yu)電(dian)化(hua)鋁(lv)(lv)基(ji)膜剝(bo)離(li)的(de)同時(shi)轉印到了(le)承(cheng)印物上(shang)(shang)。隨著(zhu)壓(ya)力的(de)卸除，膠粘(zhan)劑迅速(su)冷卻(que)固化(hua)，鋁(lv)(lv)層(ceng)牢固地附著(zhu)在(zai)承(cheng)印物上(shang)(shang)，完(wan)成一個燙印過(guo)程。