燙金基本工藝是(shi)在(zai)壓力狀態，即電(dian)化(hua)(hua)鋁被(bei)燙印版、承(cheng)(cheng)印物壓住的(de)(de)(de)狀態下(xia)，電(dian)化(hua)(hua)鋁受(shou)(shou)熱使(shi)其上(shang)熱熔(rong)性(xing)的(de)(de)(de)有機(ji)硅(gui)樹脂(zhi)層和(he)膠牯(gu)劑(ji)(ji)熔(rong)化(hua)(hua)，此時受(shou)(shou)熱熔(rong)化(hua)(hua)的(de)(de)(de)有機(ji)硅(gui)樹脂(zhi)粘性(xing)變小(xiao)，而特種(zhong)熱敏膠粘劑(ji)(ji)受(shou)(shou)熱熔(rong)化(hua)(hua)后粘性(xing)增加，使(shi)得鋁層與(yu)電(dian)化(hua)(hua)鋁基膜剝離的(de)(de)(de)同(tong)時轉印到了承(cheng)(cheng)印物上(shang)。隨著壓力的(de)(de)(de)卸除，膠粘劑(ji)(ji)迅速(su)冷(leng)卻(que)固(gu)化(hua)(hua)，鋁層牢固(gu)地附著在(zai)承(cheng)(cheng)印物上(shang)，完成一個(ge)燙印過(guo)程。