燙金基本(ben)工藝是在(zai)壓力(li)狀(zhuang)態(tai)，即電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)被(bei)燙印(yin)版、承(cheng)印(yin)物壓住(zhu)的狀(zhuang)態(tai)下(xia)，電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)受熱(re)使(shi)其(qi)上(shang)(shang)熱(re)熔(rong)性的有(you)機(ji)硅樹脂(zhi)層和膠(jiao)(jiao)牯劑熔(rong)化(hua)(hua)(hua)，此時受熱(re)熔(rong)化(hua)(hua)(hua)的有(you)機(ji)硅樹脂(zhi)粘性變小，而特種熱(re)敏(min)膠(jiao)(jiao)粘劑受熱(re)熔(rong)化(hua)(hua)(hua)后粘性增加，使(shi)得鋁(lv)(lv)層與電(dian)(dian)化(hua)(hua)(hua)鋁(lv)(lv)基膜剝離的同時轉(zhuan)印(yin)到了承(cheng)印(yin)物上(shang)(shang)。隨著壓力(li)的卸除，膠(jiao)(jiao)粘劑迅速(su)冷(leng)卻固化(hua)(hua)(hua)，鋁(lv)(lv)層牢固地附(fu)著在(zai)承(cheng)印(yin)物上(shang)(shang)，完成一個(ge)燙印(yin)過程(cheng)。