燙(tang)金基(ji)本(ben)工藝是在(zai)壓力狀(zhuang)態，即電化(hua)(hua)(hua)鋁(lv)被燙(tang)印(yin)(yin)版、承印(yin)(yin)物(wu)(wu)壓住的狀(zhuang)態下，電化(hua)(hua)(hua)鋁(lv)受(shou)熱(re)使其上(shang)熱(re)熔(rong)(rong)(rong)性的有機硅樹脂層和膠(jiao)(jiao)牯劑熔(rong)(rong)(rong)化(hua)(hua)(hua)，此時(shi)受(shou)熱(re)熔(rong)(rong)(rong)化(hua)(hua)(hua)的有機硅樹脂粘性變小(xiao)，而(er)特種熱(re)敏膠(jiao)(jiao)粘劑受(shou)熱(re)熔(rong)(rong)(rong)化(hua)(hua)(hua)后粘性增加(jia)，使得鋁(lv)層與電化(hua)(hua)(hua)鋁(lv)基(ji)膜剝離的同時(shi)轉(zhuan)印(yin)(yin)到了承印(yin)(yin)物(wu)(wu)上(shang)。隨著(zhu)壓力的卸除，膠(jiao)(jiao)粘劑迅速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)層牢(lao)固(gu)地附(fu)著(zhu)在(zai)承印(yin)(yin)物(wu)(wu)上(shang)，完成一個(ge)燙(tang)印(yin)(yin)過(guo)程(cheng)。