燙金基(ji)本工藝是在壓力(li)狀態，即電(dian)化(hua)(hua)鋁(lv)被(bei)燙印(yin)(yin)版、承(cheng)印(yin)(yin)物(wu)(wu)壓住的狀態下，電(dian)化(hua)(hua)鋁(lv)受熱(re)使(shi)其上(shang)(shang)熱(re)熔(rong)性的有機(ji)(ji)硅樹脂層(ceng)和膠(jiao)牯劑(ji)熔(rong)化(hua)(hua)，此時(shi)受熱(re)熔(rong)化(hua)(hua)的有機(ji)(ji)硅樹脂粘(zhan)性變小(xiao)，而特種熱(re)敏膠(jiao)粘(zhan)劑(ji)受熱(re)熔(rong)化(hua)(hua)后粘(zhan)性增加，使(shi)得鋁(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的同時(shi)轉印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)(wu)上(shang)(shang)。隨著(zhu)(zhu)壓力(li)的卸除，膠(jiao)粘(zhan)劑(ji)迅速冷卻固(gu)化(hua)(hua)，鋁(lv)層(ceng)牢固(gu)地附著(zhu)(zhu)在承(cheng)印(yin)(yin)物(wu)(wu)上(shang)(shang)，完成一(yi)個燙印(yin)(yin)過(guo)程。