燙金基(ji)本工(gong)藝是在(zai)壓力(li)狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙印(yin)版、承印(yin)物(wu)(wu)壓住的(de)狀態(tai)下，電(dian)化(hua)(hua)鋁(lv)(lv)受(shou)熱使(shi)其上(shang)(shang)熱熔(rong)性的(de)有(you)機(ji)硅樹脂層(ceng)和膠牯劑熔(rong)化(hua)(hua)，此時(shi)受(shou)熱熔(rong)化(hua)(hua)的(de)有(you)機(ji)硅樹脂粘(zhan)性變(bian)小，而特種熱敏膠粘(zhan)劑受(shou)熱熔(rong)化(hua)(hua)后粘(zhan)性增(zeng)加，使(shi)得(de)鋁(lv)(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)(lv)基(ji)膜剝離的(de)同時(shi)轉印(yin)到了承印(yin)物(wu)(wu)上(shang)(shang)。隨著壓力(li)的(de)卸(xie)除，膠粘(zhan)劑迅(xun)速冷卻固化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固地附著在(zai)承印(yin)物(wu)(wu)上(shang)(shang)，完(wan)成一個燙印(yin)過(guo)程。